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Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler
Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Large Image :  Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TF300
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200ml each part)
Packaging Details: 50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Delivery Time: 13-15 working days
Payment Terms: T/T

Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

Description
Composition: Ceramic Filler + Silicone Color: Light Blue
Density: 3 G/cc Breakdown Voltage: ≥7.0 Kv/mm
Usage Temperature: -40~150 ℃ Dielectric Constant: 7.0(@10mhz)
Flammability: V-0 Thermal Conductivity: 3.0 W/m.K
Viscosity/Component A: 400000 (cps) Viscosity/Component B: 400000 (cps)
Hardness, After Cure: 40 (shore Oo)
High Light:

Heatproof 2 Part Gap Filler

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Multiscene 2 Part Gap Filler

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Anti Seismic Thermally Conductive Filler

Two Part Thermal Gel Materials Liquid Gap Fillers With Light Blue For Control Modules

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Light Bule Visual
Density(g/cc) 3 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470
Viscosity/Component A (cps) 400000 ASTM D2196
Viscosity/Component B (cps) 400000 ASTM D2196
Hradness,after cure(shore OO) 40 ASTM D22240

 

Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

 

Features & Benefits

1 High thermal conductivity, low thermal resistance, excellent wettability
2 Low pressure to electronic components
3 Manageable raw material stock ,lower composite cost
4 For vehicle electronic products
5 Can fill any uneven gaps
6 Automatic point dispensing available, any thickness or size available
7 High reliability, thermal conductive gel is equal to thermal conductive silicon pad after curing, no volatility.

 

Typical Applications

1 Communication equipment
2 Power equipment
3 Medical instrument
4 New energy vehicle
5 Filling any gap between friable component and shell

 

Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)

 

Directions for use
• Working hours @ 25
C : 1 hour
• Dry to touch @ 25
C : 1 hour
• Full cure @ 25
: 12-16 hours
• Full cure @ 100
C : 1 hour

 

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler 0

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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