Product Name:Gap Filler Silicon Thermal Potting Glue Thermally Conductive Encapsulant For LED/LCD
Composition:Ceramic filler + Silicone
Thermal Resistance:0.15 (℃-in2/W)0.1mm@50psi
Product Name:Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells
Color:White
Density:1.8(g/cc)
Product Name:Thermally Conductive Encapsulant Gray Elastomer With Moderate Thermal Conductivity
Density:1.8(g/cc)
Breakdown Voltage:≥10(kv/mm)
Product Name:high voltage applications Thermal Conductive Encapsulant Potting Electric Potting Silicone
Density:1.8(g/cc)
Breakdown Voltage:≥10(kv/mm)
Product Name:0.8 W/m.K Room Temperature Curing Thermally Conductive Silicone Encapsulant For Led
Composition:Silicone
Working Time@25℃(min):30
Product Name:High Breakdown Voltage Thermal Conductivity Silicone Encapsulating For Electric Machinery
Composition:Silicone
Color/Component A:White
Product Name:1.8G/CC Density Thermal Conductivity Silicone Encapsulating For Power Battery
Composition:Ceramic filler + Silicone
Working Time@25℃(min):30
Product Name:White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer
Composition:Silicone
Color:White
Product Name:UL94-V0 Flammability Thermal Conductivity Silicone Encapsulating For Sensor
Composition:Silicone
Flammability:UL94-V0
Product Name:White Thermally Conductive Silicone Encapsulant Usage Temperature -40 ~ 150 ℃
Usage Temperature:-40 ℃ ~ 150 ℃
Color/Component A:White
Product Name:Low Thermal Resistance 0.8w/M.K Thermally Conductive Silicone Encapsulant For Power Battery
Composition:Ceramic filler + Silicone
Thermal Resistance:0.15 (℃-in2/W)0.1mm@50psi
Product Name:1.0W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation
Usage Temperature:-40 ℃ ~ 150 ℃
Thermal Resistance:0.15 (℃-in2/W)0.1mm@50psi